๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy

โœ Scribed by Tarek El-Ashram; R. M. Shalaby

Book ID
107453484
Publisher
Springer US
Year
2005
Tongue
English
Weight
144 KB
Volume
34
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Effect of indium content and rapid solid
Effect of indium content and rapid solidification on microhardness and micro-creep of Sn-Zn eutectic lead free solder alloy
โœ R. M. Shalaby ๐Ÿ“‚ Article ๐Ÿ“… 2010 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 145 KB ๐Ÿ‘ 1 views

## Abstract The Snโ€Zn alloys have been considered as leadโ€free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and microโ€creep of the Snโ€9Zn leadโ€free solders were investigated. It is shown that the a