Effect of processing variables on thermal and viscoelastic properties in TGDDM/DDS epoxy system
✍ Scribed by Wu, Ching‐Shiun
- Book ID
- 121081144
- Publisher
- Chinese Electronic Periodical Services
- Year
- 1995
- Tongue
- English
- Weight
- 623 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0253-3839
No coin nor oath required. For personal study only.
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The glass transition temperature ( T,) , water-and solvent-absorption characteristics, fracture toughness, and tensile properties of a diglycidyl ether of bisphenol-A (DGEBA) -based epoxy resin (Epikote 8283) cured with an aromatic amine curing agent, 4,4'-diaminodiphenyl sulfone (DDS) , were studie
## Abstract Antiplasticization, defined as an increase in glassy modulus of polymers upon dilution with low molecular weight compounds, was studied for highly crosslinked epoxy resins. A series of oligomers with average molecular weight 500–4000 was incorporated with epoxy resins for elucidating th