Effect of vacancies on copper precipitat
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Wang, Weiyan ;Yang, Deren ;Ma, Xiangyang ;Que, Duanlin
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Article
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2008
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John Wiley and Sons
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English
โ 424 KB
## Abstract The effect of vacancies induced by the prior rapid thermal processing (RTP) at 900โ1200 ยฐC in Ar on copper (Cu) precipitation in nโtype silicon has been investigated by means of optical microscopy and transmission electron microscopy. It was revealed that in the sample without the prior