๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Effect of oxygen plasma etching on adhesion between polyimide films and metal

โœ Scribed by Y. Nakamura; Y. Suzuki; Y. Watanabe


Book ID
114086083
Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
182 KB
Volume
290-291
Category
Article
ISSN
0040-6090

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Effect of plasma treatments on interface
โœ Hung-Chun Tsai; Yee-Shyi Chang; Shou-Yi Chang ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 781 KB

The effect of different plasma treatments on the interfacial bonding configurations and adhesion strengths between porous SiOCH ultra-low-dielectric-constant film and SiCN etch stop layer have been investigated in this study. From X-ray photoelectron spectroscopic analyses, interlayer regions of abo

Effect of an interfacial layer on adhesi
โœ Satoru Iwamori; Takehiro Miyashita; Shin Fukuda; Shouhei Nozaki; Kazufuyu Sudoh; ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 243 KB

Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox