Effect of oxygen plasma etching on adhesion between polyimide films and metal
โ Scribed by Y. Nakamura; Y. Suzuki; Y. Watanabe
- Book ID
- 114086083
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 182 KB
- Volume
- 290-291
- Category
- Article
- ISSN
- 0040-6090
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๐ SIMILAR VOLUMES
The effect of different plasma treatments on the interfacial bonding configurations and adhesion strengths between porous SiOCH ultra-low-dielectric-constant film and SiCN etch stop layer have been investigated in this study. From X-ray photoelectron spectroscopic analyses, interlayer regions of abo
Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox