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Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints

✍ Scribed by Jian Zhang; Yuan Xiao; Guoqiang Luo; Qiang Shen; Lianmeng Zhang

Book ID
113794978
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
643 KB
Volume
66
Category
Article
ISSN
0167-577X

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