✦ LIBER ✦
Effect of mold compound components on moisture-induced degradation of gold-aluminum bonds in epoxy encapsulated devices : Anthony A. Gallo. 28th A. Proc. Reliab. Phys. Symp. (IEEE), 244 (March 1990)
- Book ID
- 103283026
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 125 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
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