✦ LIBER ✦
Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices : K. E. Goodson and M. I. Flik. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 715 (1992)
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 108 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0026-2714
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