Effect of metal plate barrier without holes in forced convection of electronic equipment

✍ Scribed by Masao Fujii

• Publisher: John Wiley and Sons
• Year: 2008
• Tongue: English
• Weight: 610 KB
• Volume: 37
• Category: Article
• ISSN: 1099-2871
• DOI: 10.1002/htj.20224

✦ Synopsis

Abstract

Two rectangular block‐like elements as in an electronic module are positioned in a parallel‐walled channel and cooled by forced convection airflow. A metal plate without holes as a barrier protrudes above the plane of the modules. It is intended to function as a cover for protecting them from mechanical or electromagnetic damage, or as a thermal control device. Per‐module heat transfer coefficients in the presence of the barrier of various gaps, G, between the barrier and the channel and distance, L, between the module and the barrier were measured. In the presence of the barrier, the heat transfer coefficient at the 2nd row module is enhanced, but it is diminished at the 1st row module. Nusselt numbers are correlated as a function of Reynolds number and G/L. © 2008 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20224