✦ LIBER ✦
Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects : Thomas Kwok. Proc. IEEE/IRPS, 185 (1988)
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 133 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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