✦ LIBER ✦
Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling : Asao Nishimura, Sueo Kawai and Gen Murakami. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 639 (1989)
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 134 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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