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Effect of interfacial segregation on phase decomposition of a thin film on a patterned substrate

✍ Scribed by William C. Johnson; S. M. Wise; J. Y. Huh; J. Favergeon

Publisher
TechnoPress
Year
2003
Tongue
English
Weight
544 KB
Volume
9
Category
Article
ISSN
1598-9623

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πŸ“œ SIMILAR VOLUMES

Effect of an interfacial layer on adhesi
Effect of an interfacial layer on adhesion strength deterioration between a copper thin film and polyimide substrates
✍ Satoru Iwamori; Takehiro Miyashita; Shin Fukuda; Shouhei Nozaki; Kazufuyu Sudoh; πŸ“‚ Article πŸ“… 1998 πŸ› Elsevier Science 🌐 English βš– 243 KB

Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox