✦ LIBER ✦
Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias
✍ Scribed by Pradeep Dixit; Xiaofeng Chen; Jianmin Miao; Robert Preisser
- Book ID
- 108289852
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 957 KB
- Volume
- 516
- Category
- Article
- ISSN
- 0040-6090
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