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Effect of high intensity magnetic field on intermetallic compounds growth in SnBi/Cu microelectronic interconnect

✍ Scribed by C.Z. Liu; T.Y. Kang; W. Wei; K. Zheng; L. Fu; L. Hui; J.J. Wang; W.P. Tong


Book ID
116608646
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
550 KB
Volume
509
Category
Article
ISSN
0925-8388

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