✦ LIBER ✦
Effect of heat slug and die attach material properties on plastic pin grid array (PPGA) package stress
✍ Scribed by Mertol, A.
- Book ID
- 114560479
- Publisher
- IEEE
- Year
- 1993
- Tongue
- English
- Weight
- 919 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0148-6411
No coin nor oath required. For personal study only.