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Effect of grain boundary on lattice thermal conduction of tungsten revealed by molecular dynamics simulations

✍ Scribed by Fu, Baoqin; Lai, Wensheng; Yuan, Yue; Xu, Haiyan; Liu, Wei


Book ID
122961884
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
439 KB
Volume
303
Category
Article
ISSN
0168-583X

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