✦ LIBER ✦
Effect of downscaling nano-copper interconnects on the microstructure revealed by high resolution TEM-orientation-mapping
✍ Scribed by Ganesh, K J; Darbal, A D; Rajasekhara, S; Rohrer, G S; Barmak, K; Ferreira, P J
- Book ID
- 117992971
- Publisher
- Institute of Physics
- Year
- 2012
- Tongue
- English
- Weight
- 723 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0957-4484
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