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Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

✍ Scribed by Huang, H. (author);Winchester, K. J. (author);Suvorova, A. (author);Lawn, B. R. (author);Liu, Y. (author);Hu, X. Z. (author);Dell, J. M. (author);Faraone, L. (author)

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
531 KB
Volume
435-436
Category
Article
ISSN
0921-5093

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