Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress

✍ Scribed by A. Skwarek; J. Ratajczak; A. Czerwinski; K. Witek; J. Kulawik

• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 462 KB
• Volume: 255
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/j.apsusc.2009.03.002