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Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications

โœ Scribed by Khoo, C.G.L.; Brox, B.; Norrhede, R.; Maurer, F.H.J.


Book ID
114560623
Publisher
IEEE
Year
1997
Weight
142 KB
Volume
20
Category
Article
ISSN
1083-4400

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