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Effect of cooling mechanism and powering configurations on thermal impedances in an electronic enclosure

✍ Scribed by Manno, V.P.; Azar, K.; Leipk, G.

Book ID: 117872805
Publisher: IEEE
Year: 1990
Tongue: English
Weight: 776 KB
Volume: 13
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.62570

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