Effect of annealing on the mechanical be
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D. Chocyk; A. PrΓ³szyΕski; G. Gladyszewski
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Article
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2010
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John Wiley and Sons
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English
β 363 KB
## Abstract The realtime evolution of stress during deposition of Cu/Au and Au/Cu bilayers was studied by an inβsitu curvature measurement optical technique and annealing in the temperature range from room temperature to 400 Β°C. The Au/Cu and Cu/Au bilayers attached to silicon substrate with total