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Effect of carbon nanotube reinforcement on fracture strength of composite adhesive joints

โœ Scribed by Garrett L. Burkholder; Young W. Kwon; Randall D. Pollak

Publisher
Springer
Year
2011
Tongue
English
Weight
633 KB
Volume
46
Category
Article
ISSN
0022-2461

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This study forms composite solders by adding 0.5-3 wt% of Ni particles in situ to Sn-3.5 wt%Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a solder bath to produce a solder joint. Some of the joint specimens are retained in the as-soldered condition, while the o