Effect of Bonding Pressure on Silicon Nitride Joining Using a Nickel-Chromium-Boron Metal Filler

✍ Scribed by Yanan N. Liang; Maria Isabel Osendi; Pilar Miranzo

• Book ID: 108575620
• Publisher: John Wiley and Sons
• Year: 2003
• Tongue: English
• Weight: 248 KB
• Volume: 86
• Category: Article
• ISSN: 0002-7820
• DOI: 10.1111/j.1151-2916.2003.tb03456.x