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Effect of Argon Ion Bombardment on the Solid-State Diffusion Bonding of Copper

✍ Scribed by T.I Khan; O Ohashi

Book ID: 114388300
Publisher: Elsevier Science
Year: 1998
Tongue: English
Weight: 242 KB
Volume: 38
Category: Article
ISSN: 1359-6462
DOI: 10.1016/s1359-6462(98)00076-1

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