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Editorial- three-dimensional integrated circuits design

✍ Scribed by Xie, Y.; Marchal, P.

Book ID
117809943
Publisher
The Institution of Engineering and Technology
Year
2011
Tongue
English
Weight
43 KB
Volume
5
Category
Article
ISSN
1751-8601

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## Abstract A compact multilayer capacitor cell isolated with perforated ground was designed and fabricated using low‐temperature ceramic co‐firing (LTCC) technology for three‐dimensional (3D) RF circuit application. The vertical transmission from any interferer placed 114 ΞΌm above the capacitor ce