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ECS Transactions [ECS China Semiconductor Technology International Conference 2012 (CSTIC 2012) - Shanghai, China (March 18 - March 19, 2012)] - Low Stress TiN as Metal Hard Mask for Advance Cu-Interconnect

✍ Scribed by Liechao, Luo; Kang, Jian; Wen, James

Book ID: 127243069
Publisher: ECS
Year: 2012
Weight: 375 KB
Category: Article
DOI: 10.1149/1.3694357

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