[ECS 23rd Symposium on Microelectronics Technology and Devices - Gramado, Brazil (September 1 - September 4, 2008)] ECS Transactions - Study of a Low Cost Reballing of BGA Method with Lead-Free Solder Paste

✍ Scribed by Mazon, Talita; Prevedel, Guilherme E.; Schenkel, Egont A.; Biasoli, Marcio T.

• Book ID: 125440219
• Publisher: ECS
• Year: 2008
• Weight: 469 KB
• Volume: 14
• Category: Article
• DOI: 10.1149/1.2956083