Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding

✍ Scribed by Wang, F.; Xiang, K.; Han, L.

• Book ID: 117913372
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2012
• Tongue: English
• Weight: 864 KB
• Volume: 2
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2012.2189114