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Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

✍ Scribed by Dominique Bouchard; Sébastien Leboeuf; Jean-Paul Nadeau; Roderick I. L. Guthrie; Mihaiela Isac

Book ID: 106394281
Publisher: Springer
Year: 2009
Tongue: English
Weight: 500 KB
Volume: 44
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-008-2888-3

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