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Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling

✍ Scribed by Li, Wei; Tan, Cher Ming; Hou, Yuejin

Book ID: 121687034
Publisher: American Institute of Physics
Year: 2007
Tongue: English
Weight: 874 KB
Volume: 101
Category: Article
ISSN: 0021-8979
DOI: 10.1063/1.2723869

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