Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component

✍ Scribed by Rmili, W.; Deffarges, M.P.; Chalon, F.; Ma, Z.; Leroy, R.

• Book ID: 121559209
• Publisher: Springer US
• Year: 2013
• Tongue: English
• Weight: 542 KB
• Volume: 43
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-013-2876-5