Dynamic mechanical analysis of urea–formaldehyde resin adhesives with different formaldehyde-to-urea molar ratios

Curing of low level melamine-modified ur

Curing of low level melamine-modified urea-formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA)

✍ B. Young No; Moon G. Kim 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 170 KB 👁 2 views

## Abstract Effects of resin formulation, catalyst, and curing temperature were studied for particleboard binder‐type urea‐formaldehyde (UF) and 6 ∼ 12% melamine‐modified urea‐melamine‐formaldehyde (UMF) resins using the dynamic mechanical analysis method at 125 ∼ 160°C. In general, the UF and UMF