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Distribution of Copper Fungicide Deposits on Plant Surfaces

✍ Scribed by MARTIN, J. T.


Book ID
109576266
Publisher
Nature Publishing Group
Year
1953
Tongue
English
Weight
334 KB
Volume
172
Category
Article
ISSN
0028-0836

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Diffusion Barrier Deposition on a Copper
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Diffusion barrier materials, TiN and WN, were deposited by atomic layer deposition (ALD). The chlorine concentration of the TiN film was as low as 1.2 at.-%, and resistivity was below 200 lX cm. Ultra high aspect ratio (AR = 85) trenches were used to assess step coverage. Tungsten nitride film, depo