Discrete surface mount products for power applications
โ Scribed by Dave Hollander
- Book ID
- 103268117
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 417 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0026-2692
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Electrically conductive adhesives (ECAs) have been explored as a tin/lead (Sn/Pb) solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However, limited practical use of conductive adhesives in surface mount applications is found because of th
This paper reports on the feasibility of using surface mount technology (SMT) assembly processes and materials to produce highly parallel, high-aspect-ratio microchannel arrays. Experimental results show that the fabrication of high-aspectratio (> 40:1) microchannel arrays is possible using solder p