Directional solidification of Cu–20Sn alloy at low speed: From peritectic coupled growth to banding

✍ Scribed by Dongmei Liu; Xinzhong Li; Yanqing Su; Liangshu Luo; Bo Zhang; Jingjie Guo; Hengzhi Fu

• Book ID: 113794415
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 970 KB
• Volume: 65
• Category: Article
• ISSN: 0167-577X
• DOI: 10.1016/j.matlet.2011.03.034