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Direct bonding of micromachined silicon wafers for laser diode heat exchanger applications

โœ Scribed by Hunt, C E; Desmond, C A; Ciarlo, D R; Benett, W J


Book ID
120416936
Publisher
Institute of Physics
Year
1991
Tongue
English
Weight
634 KB
Volume
1
Category
Article
ISSN
0960-1317

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