Progressive in content and form, this practical book successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Digital Integrated Circuits maintains a consistent, logical flow of subject matter throughout. Addresses today's most sig
Digital Integrated Circuits, A Design Perspective
β Scribed by Jan M. Rabaey
- Publisher
- Prentice Hall
- Year
- 1995
- Tongue
- English
- Leaves
- 117
- Edition
- 1st
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
Intended for use in an undergraduate senior-level digital circuit design class. Advanced material appropriate for graduate courses.Progressive in content and form, this practical text successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Beginning with solid discussions on the operation of electronic devices and and in-depth analysis of the nucleus of digital design, the text maintains a consistent, logical flow of subject matter throughout, addressing today's most significant and compelling industry topics: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective.
β¦ Table of Contents
Ch.1 - Introduction......Page 1
1.5 - To Probe Further......Page 28
1.6 - Exercises......Page 31
1.1 - A Historical Perspective......Page 2
1.2 - Issues in Digital Integrated Circuit Design......Page 4
1.3.1 - Cost of an Integrated Circuit......Page 13
1.3.2 - Functionality and Robustness......Page 15
1.3.3 - Performance......Page 23
1.3.4 - Power and Energy Consumption......Page 26
Ch.2 - The Manufacturing Process......Page 33
2.1 - Introduction......Page 34
2.2.1 - The Silicon Wafer......Page 35
2.2.2 - Photolithography......Page 36
2.2.3 - Some Recurring Process Steps......Page 39
2.2.4 - Simplified CMOS Process Flow......Page 40
2.3 - Design Rules - The Contract between Designer and Process Engineer......Page 44
2.4 - Packaging Integrated Circuits......Page 48
2.4.2 - Interconnect Levels......Page 50
2.4.3 - Thermal Considerations in Packaging......Page 56
2.5 - Perspective β Trends in Process Technology......Page 57
2.5.1 - Short-Term Developments......Page 58
2.5.2 - In the Longer Term......Page 59
2.6 - Summary......Page 60
2.7 - To Probe Further......Page 61
π SIMILAR VOLUMES
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