Diffusion layer profiles in electrocatalysed reduction of Cu2+ at a Ti cathode

✍ Scribed by R.N. O'Brien; K.S.V. Santhanam

• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 384 KB
• Volume: 37
• Category: Article
• ISSN: 0013-4686
• DOI: 10.1016/0013-4686(92)85068-v

✦ Synopsis

The electrcdeposition of Cu has been carried out on a Ti cathode by passing current densities (c.d.) 0.11, 0.22, 0.55 and 1.11 mA cm-*. The deposition was followed by laser interferometry; SC values have been determined throughout the electrolysis. The growth of the diffusion layer during the electrolysis is remarkably higher with a Ti cathode as compared with that at Cu. The deposition of Cu occurs at a lower Ew at Ti, suggesting electrocatalysis. When a Ti anode is used in the .electrolysis, electrode resistance IS caused by the thin layer of oxide formed, and cell voltage re&iked for maintaining the same c.d. is higher. Electrocatalytic reduction of Cu*+ has been achieved at a,Ti cathode.