Diffusion bonding of tungsten-copper to copper based substrates by hot isostatic pressing: T. Anqing, L. Daming (Central Iron and Steel Research Inst., Beijing, China), PM Technology, Vol 11, No 4, 1993, 254–259. (In Chinese)

• Book ID: 116033633
• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 130 KB
• Volume: 49
• Category: Article
• ISSN: 0026-0657
• DOI: 10.1016/0026-0657(94)90634-3