𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Dielectric properties of Stycast 1266 over the 0.07–300 K temperature range

✍ Scribed by M Barucci; G Bianchini; E Gottardi; I Peroni; G Ventura


Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
94 KB
Volume
39
Category
Article
ISSN
0011-2275

No coin nor oath required. For personal study only.

✦ Synopsis


We used Stycast 1266 in a high-pressure, low-temperature transducer. In order to ascertain the dependence of capacitance and loss on temperature, we measured the temperature behaviour of the dielectric constant and the dissipation factor of Stycast 1266 at 1 KHz between 0.07 and 300 K. We found a smooth decrease of the dielectric constant with decreasing T. The temperature dependence below 1 K is well explained by the tunneling model. The loss tangent showed very low values (always less than 5 Â 10 À5 ), with a peak around 260 K that can be ascribed to dielectric relaxation processes.


📜 SIMILAR VOLUMES


Dielectric properties of some insulating
✍ M.J. Chant 📂 Article 📅 1967 🏛 Elsevier Science 🌐 English ⚖ 315 KB

electrical apparatus will depend, not only on the performance of the superconductors, but also on the limitation of heat from other sources, such as leakage through the thermal insulation and dielectric loss. The latter, which contributes a negligible proportion of the total heat in the apparatus wh

Dielectric properties of some insulating
✍ M.J. Chant 📂 Article 📅 1967 🏛 Elsevier Science 🌐 English ⚖ 312 KB

electrical apparatus will depend, not only on the performance of the superconductors, but also on the limitation of heat from other sources, such as leakage through the thermal insulation and dielectric loss. The latter, which contributes a negligible proportion of the total heat in the apparatus wh

Optical, electrical and structural prope
✍ N. Ahner; S.E. Schulz; F. Blaschta; M. Rennau 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 619 KB

Looking onto application of low-k and ultra low-k materials within FEOL, high temperature load is one of the major challenges. But also temperature ranges below standard curing conditions are of special interest, e.g. for integration of transparent low-k materials into optical devices due to their s