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Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing

✍ Scribed by P. Gonon; A. Sylvestre; J. Teysseyre; C. Prior

Book ID
110298879
Publisher
Springer US
Year
2001
Tongue
English
Weight
154 KB
Volume
12
Category
Article
ISSN
0957-4522

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## Abstract When a concrete surface is contaminated by water due to rain, saline water, ground water, and water jetty treatment, water, alkalis, and other contaminants on the concrete surface may interact with an epoxy adhesive used for bonding fiber‐reinforced polymer composite sheets to concrete.