Dielectric properties of epoxy/clay nanocomposites - effects of curing agent and clay dispersion method

✍ Scribed by Tagami, N.; Okada, M.; Hirai, N.; Ohki, Y.; Tanaka, T.; Imai, T.; Harada, M.; Ochi, M.

• Book ID: 121763903
• Publisher: IEEE
• Year: 2008
• Tongue: English
• Weight: 823 KB
• Volume: 15
• Category: Article
• ISSN: 1070-9878
• DOI: 10.1109/T-DEI.2008.4446733