Dielectric properties of cured epoxy resins containing the perfluorobutenyloxy group
β Scribed by S. Sasaki
- Publisher
- Wiley (John Wiley & Sons)
- Year
- 1986
- Tongue
- English
- Weight
- 177 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0887-6258
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A synthesized polydimethylsiloxane containing an isocyanate group was used to improve the flexibility and to reduce the internal stress of epoxy resin cured with MDA (4,4Π-methylene dianiline). The effect of polysiloxane content on the curing kinetics of a novolac-type epoxy modified with an isocyan
The curing of a particular epoxy resin (digiycidylether of bisphenol-A) by three amino hardeners (4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulphone and 4,4'-diaminodiphenylether) is followed by dielectric measurements performed under microwave heating. The formation on heating of a molecular