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Dielectric and mechanical studies of the durability of adhesively bonded CFRP structures subjected to aging in various solvents

✍ Scribed by Banks, W. M.; Pethrick, R. A.; Armstrong, G. S.; Crane, R. L.; Hayward, D.

Book ID: 124089976
Publisher: SAGE Publications
Year: 2004
Tongue: English
Weight: 218 KB
Volume: 218
Category: Article
ISSN: 1464-4207
DOI: 10.1177/146442070421800402

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