✦ LIBER ✦
Die attach failures related to wafer back metal processing—an AES study
✍ Scribed by M.K. Radhakrishnan
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 179 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0026-2714
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