Development of an Indium bump bond process for silicon pixel detectors at PSI

✍ Scribed by Ch. Broennimann; F. Glaus; J. Gobrecht; S. Heising; M. Horisberger; R. Horisberger; H.C. Kästli; J. Lehmann; T. Rohe; S. Streuli

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 427 KB
• Volume: 565
• Category: Article
• ISSN: 0168-9002
• DOI: 10.1016/j.nima.2006.05.011