✦ LIBER ✦
Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering
✍ Scribed by G. Elger; M. Hutter; H. Oppermann; R. Aschenbrenner; H. Reichl; E. Jäger
- Book ID
- 106186403
- Publisher
- Springer-Verlag
- Year
- 2002
- Tongue
- English
- Weight
- 227 KB
- Volume
- 7
- Category
- Article
- ISSN
- 0946-7076
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