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Development of a test method for measuring the mixed mode fracture resistance of bimaterial interfaces

✍ Scribed by P.G. Charalambides; H.C. Cao; J. Lund; A.G. Evans


Book ID
107918717
Publisher
Elsevier Science
Year
1990
Tongue
English
Weight
900 KB
Volume
8
Category
Article
ISSN
0167-6636

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Accurate characterization of interfacial adhesion is essential for the development of reliable wafer bonding processes. In most applications in which wafers are bonded, the interface experiences a combination of shear and normal loading (i.e., mixed-mode loading). When characterizing the fracture pr