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Development of a solder bump technique for contacting a three-dimensional multi electrode array

✍ Scribed by T. A. Frieswijk; J. A. Bielen; W. L. C. Rutten; P. Bergveld

Book ID: 106186267
Publisher: Springer-Verlag
Year: 1997
Tongue: English
Weight: 562 KB
Volume: 3
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s005420050054

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