𝔖 Bobbio Scriptorium

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Development of a plastic encapuslated multichip technology for high volume, low cost commercial electronics : RAYMOND A. FILLION et al. IEEE Transactions on Component, Packaging and Manufacturing Technology, Part B, 18(1), 59 (February 1995)

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 229 KB
Volume: 36
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(96)84447-7

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